Qualcomm Hiring Engineering Intern | Apply Now

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Qualcomm is employing recent graduates for the position of engineering intern. The job description, prerequisites, and more details are provided below.

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About Qualcomm

Incorporated in Delaware, Qualcomm Incorporated is a global corporation based in San Diego, California, with operations worldwide. It produces software, semiconductors, and wireless technology-related services. It is the owner of patents that are essential to the mobile communications standards of 5G, 4G, CDMA2000, TD-SCDMA, and WCDMA.

Qualcomm Hiring Engineering Intern Details

Job Role: Engineering Intern

Company Website: www.qualcomm.com

Qualification: Any Bachelor’s degree

Batch: 2025,2024

Experience: Fresher’s

Salary: As per company standards

Job Location: Hyderabad, Bangalore, Chennai, Noida, India

Last Date: ASAP

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Roles & Responsibilities

  • Interpersonal abilities, including the capacity to accurately and simply explain complicated transactional concerns to both internal and external clients.
  • The operational procedures needed to address recognised risk-related patterns must be documented in a clear, concise, and proactive manner.
  • Logical problem-solving abilities with a track record of identifying hidden patterns and patterns.
  • Time management and organisational skills are impacted by self-discipline, diligence, proactivity, and attention to detail.
  • A teammate who is able to pick up and share knowledge in a worldwide setting.
  • Show that you are willing to work extra hours when needed for the company.

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Required Skills & Qualifications

  • Electrical engineering, computer science, communication, electronics, and communications engineering.
  • Bachelor’s or master’s degree, with graduation in 2024 or 2025.

Software Engineering Intern

  • 2024 graduation.
  • Must be accessible immediately for a period of two or six months.
  • Solid knowledge of data structures, OS ideas, etc.
  • Object-oriented design and C/C++
  • Creation of device drivers and real-time embedded software.
  • Windows Mobile, Android, or Linux mobile SW development.
  • Linux/UNIX, Linux Kernel Development, Linux Drivers.

Hardware Engineering Intern

  • 2025 graduation.
  • The 11-month internship, which runs from July 24 to June 25, must be available.
  • Verifying SoC with integrated DSP/RISC processors and ASICs for networking and communications.
  • C/C++, Tcl/Perl/shell scripting, Verilog or VHDL. RTL design expertise and/or a solid understanding of OO programming.
  • Familiarity with VLSI, wireless and wired protocols, and graphics and video multi-media.
  • PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout knowledge is necessary for the design of RF, analogue, and mixed signal integrated circuits.

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